Hybrid integrated chip-scale laser systems

Photonic integrated circuits (PICs) allow for the rapid advancement of a wide range optical devices on compact platform, making them more useful and readily available in commercial market. Various materials such as III–V semiconductors, silicon, silicon nitride, lithium niobate, polymers are used to create PICs with certain unique properties. Hybrid integration can combine multiple material platforms via coupling realize multi-functional that overcome limitations single platform. This allows broad application base hybrid PICs, greatly enhancing their usability practicality. In this paper, we will discuss methodology applications chip-scale laser systems, including narrow linewidth, widely tunable external cavity lasers, beam combining, frequency combs, Pockels lasers.